Job Purpose: We are seeking a hands-on Semiconductor Packaging Engineer to work for a High-Tech Semiconductor Manufacturer in the Tucson, Area. The Semiconductor Packaging Engineer will ensure stable, robust, repeatable, sustainable and high-yielding manufacturing processes and products are achieved, monitored and maintained and will help to implement a new MES system. Process development and optimize physical packaging. Developing and improving manufacturing processes for packaging, including wafer-level and chip-level assembly, and bonding.

Responsibilities include development, continuous improvement, and sustaining processes all in close partnership with Device and Integration Engineering as well as design teams. You will be expected to clearly communicate goals, roles, and responsibilities, engage and motivate engineering talent, define and set deliverables, plan resources, and achieve desired results. You will be expected to contribute technically, maintain an optimistic, can-do approach, and present status to executive level management. Excellent judgment, expertise in semiconductor processing, and leadership are essential to success in this role. The position reports to the Process Engineering Manager. Will monitor and control of the process. Improve the process or introduce new process and tools to improve yield, capacity and quality. Work with engineering team to develop new products. Work with engineering team to transfer new products or new process to production and will help to implement a new MES system.

Position responsibilities include daily oversight of manufacturing operations, continuous improvement of operational processes including scheduling and executing production for Back End Assembly Process. Conducts studies in operations to optimize workflow and space utilization. Ensures facility efficiency and workplace safety.

Responsibilities:

Manufacturing monitoring and improvements with SPC. Creating weekly yield reports using statistical tools. Creating and maintaining work standards using work measurement, and dynamic and static capacity and cost simulation models. Workflow optimization through creating and implementing in-process kanbans models. Working with materials manager for supply chain optimization and inventory minimization through creating and implementing raw material kanbans. Design of Experiments (DOE) and data analysis to support engineering efforts to improve product design and manufacturability. Performance measurement and analysis to monitor and improve manufacturing. Applying various statistical methods to improve reproducibility and manufacturability through Failure Mode Effect Analysis (FMEA) , Control Plan and Gage R&R studies. Data analysis and improvements to manufacturing capabilities. Work with information technology department to improve database structures and collection methods to improve manufacturing. Cost and net worth analysis to evaluate capital expenditures for expansion scenarios. Maximize space utilization through layout evaluation, design, and improvements, using design software such as AutoCAD, Draftsight.

Duties:

Develop and maintain positive working relationships with applicable departments and suppliers to evaluate potential new processes and materials to improve cost, yield, reliability and quality.
Drive identification and implementation of process improvements to increase yield and reduce operating costs.
Identify new hardware requirements to meet the developing process/customer needs. Ensure these requirements are addressed appropriately with regard to specifications, budget constraints, supplier identification and thorough evaluation.
Develop, modify and/or continuously improve manufacturing process and procedures to enable higher productivity, reduced scrap, and improved quality.

Skills/Qualifications:

Must have a B.S. or M.S. Electrical or Mechanical Engineering or a related field.

Must have knowledge of process Assembly of semiconductor lasers. Communication and managing skills are required.

Clean room manufacturing environment, experience working in cleanrooms and labs.

Exposure to medium to long term projects.

3+ years of experience within the semiconductor industry (die bonding, oven, wire bonding, lead frame design, SMT, reflowing, among other processes).

New Product Introduction. Strong verbal, written, presentation, analytical and interpersonal skills.

Leadership capabilities to drive and deliver results through motivating cross-cultural teams.

Highly proficient in Excel, Word, Powerpoint and statistical software.

Strong analytical and problem solving ability. Appreciation of both practical and theoretical methodologies.

Experienced in equipment selection, commissioning and process set-up.

Knowledge of troubleshooting guides, working documentation, safety.

Knowledge of quality systems and reliability assessment.

Strong SPC and DOE skill set and experience.

Experience with Lean and 5S programs. Experience with Six Sigma.

Demonstrated success in project management.

Detailed working knowledge of semiconductor wafer fabrication processes, including wet and dry etching, thin films, moderate scale photolithography.

Proven track record in program management and technical team leadership.

Self-motivated with the ability to work both independently and in a team environment

This position is located in the United States and will require use of information which is subject to the International Traffic in Arms Regulations (ITAR). As such, all applicants must be U.S. persons within the meaning of ITAR. ITAR defines a U.S. person as a U.S. Citizen, U.S. Permanent Resident (i.e. 'Green Card Holder'), Political Asylee, or Refugee.

Leonardo is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability status, protected veteran status, or any other characteristic protected by law.

(NOTE: The above statements are intended to describe the general nature and level of work being performed by people assigned to this classification. They are not to be construed as an exhaustive list of all responsibilities, duties, and skills required of personnel so classified. All personnel may be required to perform duties outside of their normal responsibilities from time to time, as needed.)

Here are the hiring process steps and what you can expect from us:

Step 1: Application Review:

Upon submitting your application, it is made available to the recruitment team to review and ensure you meet the basic qualifications.

Step 2: Interview:

If you have been identified to move forward in the process, you may be invited to participate in a one-on-one or panel interview. The interview format can be a phone call, in-person, or virtual meeting.

Step 3: Offer:

If you reach this stage of the interview process, congratulations! You will be provided an offer to join the Leonardo Electronics US Inc. team. The offer will include details about your salary, benefits package and start date.

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Leonardo Electronics US Inc

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