Role: Technical Program Manager II - Remote Location: 100% Remote (Global) Compensation: USD 90–110 per hour About the Role We are seeking a Technical Program Manager II to support a high-impact hardware team developing next-generation AR wearable devices . This role focuses on flexible and rigid PCB development, electrical component integration, and end-to-end program execution across global manufacturing partners. The ideal candidate has strong experience in PCB fabrication, flex circuits, MLBs (multi-layer boards), and APAC contract manufacturer management , along with the ability to operate in fast-paced, high-ambiguity environments. Key Responsibilities Hardware Program Ownership Drive end-to-end ownership of flex and rigid PCB design releases from early development through production Manage schematics, layout reviews, form development, vendor approval, and fabrication readiness Track milestones, schedules, and risks across hardware development cycles Manage SMT (Surface Mount Technology) and FATP (Final Assembly, Test & Pack) builds Optimize schedule, yield, quality, and cost across manufacturing phases Engage directly with APAC contract manufacturers and flex vendors Ensure supplier readiness and manage vendor performance Cross-Functional Collaboration Partner with Electrical Engineering and cross-functional hardware teams Gather design feedback and drive issue resolution Communicate program status, risks, and mitigation plans to stakeholders Required Qualifications Minimum 5+ years of experience in electrical design, PCB development, or hardware engineering program management Direct ownership of flex and multi-layer board (MLB) releases from concept to production Experience managing SMT and FATP builds end-to-end Experience engaging flex vendors and ensuring supplier readiness Strong risk management, schedule tracking, and cross-functional coordination skills Preferred Qualifications Experience integrating small electrical components in constrained form factors Knowledge of advanced PCB fabrication processes and materials Degree in Electrical Engineering or related technical discipline Core Competencies PCB Fabrication & Development Flex Circuits & Multi-Layer Boards (MLBs) AR Wearables Hardware SMT & FATP Build Management Electrical Component Integration Hardware Program Lifecycle Management Risk Mitigation & Yield Optimization Equal Opportunity Statement We are an equal opportunity employer and consider all qualified applicants without regard to legally protected characteristics. Reasonable accommodations are available upon request. #J-18808-Ljbffr
